HyperX HX426C15FBK2/8 is a kit of two 1G x 64-bit (8GB) DDR4–2666 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 1G x 8-bit FBGA components per module. Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. Total kit capacity is 16GB. Each module has been tested to run at DDR4–2666 at a low latency timing of 16–18–18 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:

JEDEC/XMP TIMING PARAMETERS

• JEDEC/PnP: DDR4–2666 CL16–18–18 @1.2V
• XMP Profile #1: DDR4–2666 CL16–18–18 @1.2V

FEATURES

• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP – 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• Height 1.340” (34.04mm), w/heatsink

SPECIFICATIONS

• CL(IDD): 15 cycles
• Row Cycle Time (tRCmin): 45ns(min.)
• Refresh to Active/Refresh Command Time (tRFCmin): 260ns(min.)
• Row Active Time (tRASmin): 26.25ns(min.)
• Maximum Operating Power: TBD W*
• UL Rating: 94 V – 0
• Operating Temperature:0 C to +85 C
• Storage Temperature: –55 C to +100 C