Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

Name: Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
SKU: 8962043
Price: 407.99 AUD
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Description

This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP.

Release date Australia

December 15th, 2010

Author

Audience

Professional & Vocational

Edition

Softcover reprint of hardcover 1st ed. 2004

Illustrations

XXIV, 311 p.

Pages

311

Dimensions

156x234x17

ISBN-13

9783642061158

Product ID

8962043

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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

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