The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies_completely updated
Wire bonding is the attachment of fine wires from semiconductor chips to their substrates--a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics.
"Wire Bonding in Microelectronics, Second Edition, " equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Second Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping,
George G. Harman is a Fellow of the National Institute of Standards and Technology's Semiconductor Electronics Division.
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