LED Packaging for Lighting Applications

Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products.

One of the only books to cover LEDs from package design to manufacturing to testing
Focuses on the design of LED packaging and its applications such as road lights
Includes design methods and experiences necessary for LED engineers, especially optical and thermal design
Introduces novel LED packaging structures and manufacturing processes, such as ASLP
Covers reliability considerations, the most challenging problem for the LED industry
Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures
Codes and demonstrations available from the book’s Companion Website

This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led

Author Biography

Sheng Liu is a ChangJiang Professor of MechanicalEngineering at Huazhong University of Science and Technology. Heholds a dual appointment at Wuhan National Laboratory forOptoelectronics, and has served as tenured faculty at Wayne StateUniversity. He has over 14 years experience in LED/MEMS/ICpackaging and extensive experience in consulting with many leadingmulti-national and Chinese companies. Liu was awarded the WhiteHouse/NSF Presidential Faculty Fellowship in 1995, ASME YoungEngineer Award in 1996, and China NSFC Overseas Young Scientist in1999. He has been an associate editor for IEEE Trans. On ElectronicPackaging Manufacturing since 1999 and an associate editor ofJournal of Frontiers of Optoelectronics in China since 2007. He iscurrently one of the 11 National Committee Members in LED underMinistry of Science and Technology. He obtained a Ph.D. fromStanford in 1992, and got MS and BS in flight vehicle design,Nanjing University of Aeronautics and Astronautics, and he hadthree years industrial experience in China and USA. He has filedmore than 70 patents in China and the USA, and has published morethan 300 technical articles. Xiaobing Luo is a professor at Huazhong University ofScience and Technology, Wuhan, China, with appointments at theSchool of Energy and Power Engineering and Wuhan National Lab forOptoelectronics. He received his Ph.D. in 2002 from TsinghuaUniversity, China. He has also worked in Samsung Electronics inKorea as a Senior Engineer. His main research interests are LED,heat and mass transfer, microfluidics, MEMS, and sensors andactuators. He has published more than 60 papers and has applied for40 patents in the USA, Korea, Japan, Europe and China.