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Cutting-edge information about materials, technologies, and mechanisms of printed electronics, and their applications for the smart packaging
Printed Electronics for Smart Packaging describes how and why to use printed electronic devices for application in smart packaging.
Written by two highly qualified academics, Printed Electronics for Smart Packaging covers sample topics such as:
Applications of printed electronics, such as flexible screens, intelligent labels and packaging, interactive books and posters, and even upholstery
Mechanisms of smart packaging, printing methods and integrated strategies, and functional inks and substrates for smart packaging
Printed tracks for smart tags and IPES, printed optoelectronic devices and energy suppliers for smart packaging, and printed sensors and indicators
Integrated printed electronics systems, and expert outlooks and perspectives on potential future directions for research and development in the field
Author Biography
Wei Wu is full professor and Head of Laboratory of Printable Functional Materials and Printed Electronics, Dean of School of Printing and Packaging, Wuhan University. He received the 15th Bi Shen Award of Printing Technology in 2019, STAM Best Paper Award in 2017 and Hong Kong Scholars Award in 2014.
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