This is the classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies completely updated. Wire bonding is the attachment of fine wires from semiconductor chips to their substrates - a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics. "Wire Bonding in Microelectronics, Third Edition", equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Third Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping.
George Harman is a Fellow of the National Institute of Standards and Technology's Semiconductor Electronics Division.