Chemical-Mechanical Polishing – Fundamentals and Challenges: Volume 566

Name: Chemical-Mechanical Polishing – Fundamentals and Challenges: Volume 566
SKU: 12558217
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Hardback

Series:

Mrs Proceedings

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Description

Chemical-mechanical planarization (CMP) has emerged over the past few years as a key enabling technology in the relentless drive of the semiconductor industry towards smaller, faster and less expensive interconnects. However, there are still many gaps in the fundamental understanding of the overall CMP process and the associated defect and contamination issues. This book brings together many of the active players in the field to focus on the interdisciplinary nature of these challenges. It reflects, to some extent, the role played by both academic institutions and multinational corporations in opening up the frontiers in the field of CMP for wider dissemination. Both experimental and theoretical contributions are included. Topics include: overview and oxide polishing; pads and related issues; metal polishing - W and Al; copper polishing and related issues; CMP modeling and fluid flow; and particle adhesion and post-polish cleaning.

Release date Australia

February 10th, 2000

Audience

Professional & Vocational

Contributors

Edited by M. Krishnan
Edited by M. Tsujimura
Edited by S. Danyluk
Edited by S. V. Babu

Illustrations

Worked examples or Exercises

Pages

281

Series

Mrs Proceedings

Dimensions

157x234x23

ISBN-13

9781558994737

Product ID

12558217

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Chemical-Mechanical Polishing – Fundamentals and Challenges: Volume 566

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