Chip On Board

Technology for Multichip Modules

By:

John H Lau

Format:

Hardback

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Description

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Release date Australia

June 30th, 1994

Author

John H Lau

Audiences

General (US: Trade)
Undergraduate

Edition

1994 ed.

Illustrations

XX, 556 p.

Pages

556

Dimensions

156x234x31

ISBN-13

9780442014414

Product ID

2551137

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