Electronic Packaging for High Reliability, Low Cost Electronics

Name: Electronic Packaging for High Reliability, Low Cost Electronics
SKU: 2810120
Price: 429.99 AUD
Availability: InStock

Format:

Hardback

Series:

NATO Science Partnership Subseries: 3

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Description

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The text embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. Also, the text provides a useful entry to the literature, with lists of more than 800 references covering a range of subject matter. It should have a valuable role as a source of information and ideas for research and development workers, practical nutritionists, for those engaged in education, extension and consultancy and for interested students.

Release date Australia

February 29th, 2000

Audiences

Postgraduate, Research & Scholarly
Professional & Vocational
Undergraduate

Contributors

Edited by Darko Belavic
Edited by Marija Kosec
Edited by R. R. Tummala
Edited by W.K. Jones

Illustrations

X, 296 p.

Pages

296

Series

NATO Science Partnership Subseries: 3

Dimensions

155x235x19

ISBN-13

9780792352181

Product ID

2810120

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Electronic Packaging for High Reliability, Low Cost Electronics

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