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Microscale Heat Conduction in Integrated Circuits and Their Constituent Films on Hardback by Y. Sungtaek Ju
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films on Hardback by Y. Sungtaek Ju
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Microscale Heat Conduction in Integrated Circuits and Their Constituent Films

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Description

The study of thermal phenomena in microdevices has attracted significant attention recently. The interdisciplinary nature of this topic, however, makes it very difficult for researchers to fully understand details of research results presented in journal articles. Advances in semiconductor device technology render the thermal characterization and design of ICs increasingly more important. The present book discusses experimental and theoretical studies of heat transfer in transistors and interconnects. A novel optical thermometry technique captures temperature fields with high temporal and spatial failures in devices that are subjected to electrical overstress (EOS) and electrostatic discharge (ESD). Also reported are techniques for determining the thermal transport properties of dielectric passivation layers and ultra-thin silicon-on-insulator (SOI) layers. Theoretical analysis on the data yields insight into the dependence of thermal properties on film processing conditions. The techniques and data presented here will greatly aid the thermal engineering of interconnects and transistors.
Release date Australia
August 31st, 1999
Audiences
  • Postgraduate, Research & Scholarly
  • Professional & Vocational
  • Undergraduate
Illustrations
XXI, 102 p.
Pages
102
Dimensions
156x234x9
ISBN-13
9780792385912
Product ID
2052254

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Books >
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Technology >
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Electronics engineering >
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Semi-conductors & super-conductors
Books >
Non-Fiction >
Technology >
Electronics & communications engineering >
Electronics engineering >
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