Solder Joint Technology

Materials, Properties, and Reliability

By:

King-Ning Tu

Format:

Paperback / softback

Series:

Springer Series in Materials Science

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Description

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

Release date Australia

November 19th, 2010

Author

King-Ning Tu

Audience

Professional & Vocational

Edition

Softcover reprint of hardcover 1st ed. 2007

Illustrations

XVI, 370 p.

Pages

370

Series

Springer Series in Materials Science

Dimensions

156x234x20

ISBN-13

9781441922847

Product ID

11084050

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