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Wafer Bonding

Applications and Technology
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Description

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Release date Australia
September 30th, 2011
Audience
  • Professional & Vocational
Contributors
  • Edited by Marin Alexe
  • Edited by Ulrich Gosele
Edition
Softcover reprint of the original 1st ed. 2004
Illustrations
20 Illustrations, color; 363 Illustrations, black and white; XV, 504 p. 383 illus., 20 illus. in color.
Pages
504
Dimensions
155x235x27
ISBN-13
9783642059155
Product ID
8961732

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