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Arbitrary Modeling of TSVs for 3D Integrated Circuits on Hardback by Khaled Salah
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Arbitrary Modeling of TSVs for 3D Integrated Circuits

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Description

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Release date Australia
September 5th, 2014
Audience
  • Professional & Vocational
Illustrations
99 Illustrations, color; 60 Illustrations, black and white; IX, 179 p. 159 illus., 99 illus. in color.
Pages
179
Dimensions
155x235x13
ISBN-13
9783319076102
Product ID
22408479

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Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah
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by Khaled Salah ~ Paperback / softback
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